Описание
Fuzion 1g THERMAL PASTE High-performance thermal paste specially designed for overclocking or gaming PCs. Comes with 1g thermal paste that’s easy to apply and perfectly fills the space between your cooler and CPU. Nanotechnology in the paste improves heat conduction via its micro molecules. Made with non-electric conductive materials, this thermal paste is completely safe to use. Comes with a spreader for quick and easy application. Resealable storage bag for convenient usage and storage Highly durable for long-lasting use of up to 8 years High viscosity allows for easy application Nanotechnology improves heat conduction Non-electric conductive materials ensure safe usage Low evaporation point and high temperature tolerance Spreader allows for quick and easy application Comes with 1 gram of thermal paste SPECS Model Fuzion-1g Thermal Conductivity >13.5 W/m-K Thermal Impedance 0.05°C-cm2/W Specific Gravity 2.6 Viscosity 1200 poise Thixotropic Index 330 ±10mm Moment Beared Temperature -50~150℃ Operation Temperature -30~130℃ Silicone Compounds 25% Carbon Compounds 15% Metal Oxide Compounds 60% Net Weight 1g